Patent Assignment Details
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Reel/Frame: | 044740/0759 | |
| Pages: | 3 |
| | Recorded: | 01/26/2018 | | |
Attorney Dkt #: | 251367-1790 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/02/2019
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Application #:
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15881030
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Filing Dt:
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01/26/2018
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Publication #:
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Pub Dt:
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08/16/2018
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Title:
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SEMICONDUCTOR PACKAGE WITH EMBEDDED SUPPORTER AND METHOD FOR FABRICATING THE SAME
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Assignee
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NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK, LLP
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3100 INTERSTATE NORTH CIRCLE
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SUITE 150
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ATLANTA, GA 30339
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