Patent Assignment Details
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| Reel/Frame: | 022764/0762 | |
| Pages: | 8 |
| | Recorded: | 06/03/2009 | | |
| Attorney Dkt #: | MEG 04-020C-E01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/21/2009
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Application #:
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11877658
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Filing Dt:
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10/23/2007
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Publication #:
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Pub Dt:
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02/21/2008
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Title:
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POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
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Assignee
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| ROOM 301/302, NO. 47, PARK 2ND RD., |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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MEGICA CORPORATION
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ROOM 301/302, NO. 47, PARK 2ND RD.,
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HSINCHU, 300 TAIWAN
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