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Reel/Frame:063663/0762   Pages: 31
Recorded: 05/16/2023
Attorney Dkt #:514935.5001128
Conveyance: CORRECTIVE ASSIGNMENT ADD THE OMITTED SECOND ASSIGNEE PREVIOUSLY RECORDED ON REEL 062626 FRAME 0397. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18104856
Filing Dt:
02/02/2023
Publication #:
US20230197572
Pub Dt:
06/22/2023
Title:
THROUGH-SILICON-VIA STRUCTURE AND METHOD FOR PREPARING SAME, THROUGH-SILICON-VIA INTERCONNECTION STRUCTURE AND METHOD FOR PREPARING SAME, AND ELECTRONIC DEVICE
Assignors
1
ZHENG, WEIWEN
Exec Dt:
12/05/2022
2
XIONG, KANGLIN
Exec Dt:
12/05/2022
3
FENG, JIAGUI
Exec Dt:
12/05/2022
4
LI, XIAOWEI
Exec Dt:
12/05/2022
5
ZHANG, WENLONG
Exec Dt:
11/18/2022
6
BU, KUNLIANG
Exec Dt:
10/02/2022
7
LI, DENGFENG
Exec Dt:
02/01/2023
Assignees
1
TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
35/F, TENCENT BUILDING, KEJIZHONGYI ROAD
MIDWEST DISTRICT OF HI-TECH PARK, NANSHAN DISTRICT
SHENZHEN, CHINA 518057
2
GUSU LABORATORY OF MATERIALS
388 RUOSHUI ROAD
INDUSTRIAL PARK
SUZHOU, CHINA 215123
Correspondence name and address
JUN CHENG
PO BOX 10395
CHICAGO, IL 60610

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