Patent Assignment Details
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Reel/Frame: | 015768/0765 | |
| Pages: | 3 |
| | Recorded: | 09/01/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/29/2011
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Application #:
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10932409
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Filing Dt:
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09/01/2004
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Publication #:
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Pub Dt:
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09/29/2005
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Title:
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INTEGRATED CIRCUIT MODULE PACKAGE AND ASSEMBLY METHOD THEREOF
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Assignee
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5 F EMERALD BUILDING |
1364-29, SEOCHO-DONG, SEOCHO-GU |
SEOUL, 137-863, KOREA, REPUBLIC OF |
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Correspondence name and address
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CARR & FERRELL LLP
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STANLEY J. PAWLIK
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2200 GENG ROAD
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PALO ALTO, CA 94303
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