Patent Assignment Details
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| Reel/Frame: | 036483/0765 | |
| Pages: | 3 |
| | Recorded: | 09/03/2015 | | |
| Attorney Dkt #: | 2014-021USCIP (0787U1) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/2015
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Application #:
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14329480
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Filing Dt:
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07/11/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Title:
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FLIP-CHIP ASSEMBLY COMPRISING AN ARRAY OF VERTICAL CAVITY SURFACE EMITTING LASERS (VCSELSs), AND AN OPTICAL TRANSMITTER ASSEMBLY THAT INCORPORATES THE FLIP-CHIP ASSEMBLY
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Assignee
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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FLOYD E. ANDERSON
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4380 ZIEGLER ROAD
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FORT COLLINS, CO 80525
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