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Patent Assignment Details
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Reel/Frame:031485/0767   Pages: 10
Recorded: 10/24/2013
Attorney Dkt #:074658-13066
Conveyance: SECURITY AGREEMENT
Total properties: 5
1
Patent #:
Issue Dt:
01/04/2011
Application #:
11447327
Filing Dt:
06/06/2006
Publication #:
Pub Dt:
12/21/2006
Title:
METHOD OF FORMING A HEAT TRANSFER SURFACE FOR ELECTRONIC COOLING
2
Patent #:
NONE
Issue Dt:
Application #:
12573107
Filing Dt:
10/03/2009
Publication #:
Pub Dt:
04/07/2011
Title:
COLD PLATE WITH PINS
3
Patent #:
NONE
Issue Dt:
Application #:
13191281
Filing Dt:
07/26/2011
Publication #:
Pub Dt:
02/02/2012
Title:
ELECTRONICS SUBSTRATE WITH ENHANCED DIRECT BONDED METAL
4
Patent #:
Issue Dt:
06/13/2017
Application #:
13601206
Filing Dt:
08/31/2012
Publication #:
Pub Dt:
12/20/2012
Title:
METHOD OF PRODUCING AN ENHANCED BASE PLATE
5
Patent #:
Issue Dt:
01/27/2015
Application #:
13770426
Filing Dt:
02/19/2013
Publication #:
Pub Dt:
10/10/2013
Title:
METHOD OF MANUFACTURING AN INTEGRATED COLD PLATE FOR ELECTRONICS
Assignor
1
Exec Dt:
10/24/2013
Assignee
1
500 FIRST AVENUE
PITTSBURGH, PENNSYLVANIA 15219
Correspondence name and address
TIMOTHY D. PECSENYE
ONE LOGAN SQUARE
8TH FLOOR
PHILADELPHIA, PA 19103-6998

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