Patent Assignment Details
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| Reel/Frame: | 034064/0767 | |
| Pages: | 3 |
| | Recorded: | 10/29/2014 | | |
| Attorney Dkt #: | 92970-905478-000440US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2016
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Application #:
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14245191
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Filing Dt:
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04/04/2014
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Publication #:
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Pub Dt:
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11/20/2014
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Title:
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METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING
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Assignee
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| 5600 EUBANK BOULEVARD NE |
| SUITE 170 |
| ALBUQUERQUE, NEW MEXICO 87111 |
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Correspondence name and address
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KILPATRICK TOWNSEND & STOCKTON LLP
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TWO EMBARCADERO CENTER
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EIGHTH FLOOR
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SAN FRANCISCO, CA 94111-3834
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