Patent Assignment Details
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| Reel/Frame: | 051375/0768 | |
| Pages: | 3 |
| | Recorded: | 12/27/2019 | | |
| Attorney Dkt #: | LGCHEM 3.9F-1860 CON |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/02/2021
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Application #:
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16581866
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Filing Dt:
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09/25/2019
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Publication #:
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Pub Dt:
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01/16/2020
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Title:
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Partially Molded Substrate And Partial Molding Device And Method
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Assignee
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| 128, YEOUI-DAERO |
| YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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Correspondence name and address
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LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
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20 COMMERCE DRIVE
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CRANFORD, NJ 07016
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