Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 059115/0768 | |
| Pages: | 5 |
| | Recorded: | 02/15/2022 | | |
| Attorney Dkt #: | 22836-1 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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12/22/2009
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Application #:
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11250421
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Filing Dt:
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10/17/2005
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Publication #:
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Pub Dt:
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04/12/2007
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Title:
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NOVEL INTEGRATED CIRCUIT SUPPORT STRUCTURES AND THEIR FABRICATION
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Patent #:
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Issue Dt:
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03/23/2010
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Application #:
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11421600
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Filing Dt:
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06/01/2006
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Publication #:
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Pub Dt:
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12/06/2007
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Title:
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ADVANCED MULTILAYER CORELESS SUPPORT STRUCTURES AND METHOD FOR THEIR FABRICATION
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Patent #:
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Issue Dt:
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03/02/2010
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Application #:
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11737269
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Filing Dt:
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04/19/2007
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Publication #:
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Pub Dt:
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12/20/2007
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Title:
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CORELESS CAVITY SUBSTRATES FOR CHIP PACKAGING AND THEIR FABRICATION
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Assignee
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| FOUNDERPCB INDUSTRY PARK |
| FUSHAN INDUSTRY ZONE |
| QIANWU, DOUMEN, ZHUHAI, CHINA 519173 |
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Correspondence name and address
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WIGGIN AND DANA LLP ATTENTION: PATENT DOCKET
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WIGGIN & DANA LLP
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ONE CENTURY TOWER
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NEW HAVEN, CT 06508-1832
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