Patent Assignment Details
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| Reel/Frame: | 024988/0769 | |
| Pages: | 4 |
| | Recorded: | 09/15/2010 | | |
| Attorney Dkt #: | TW-GNA-0764DIV1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12882324
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Filing Dt:
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09/15/2010
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Publication #:
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Pub Dt:
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01/06/2011
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Title:
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METHOD OF DIE REARRANGEMENT PACKAGE STRUCTURE HAVING PATTERNED UNDER BUMP METALLURGIC LAYER CONNECTING METAL LEAD
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Assignees
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| NO.1, R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON, BERMUDA HM 12 |
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Correspondence name and address
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SINORICA, LLC
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2275 RESEARCH BLVD.
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SUITE 500
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ROCKVILLE, MD 20850
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