Patent Assignment Details
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| Reel/Frame: | 051544/0770 | |
| Pages: | 6 |
| | Recorded: | 01/17/2020 | | |
| Attorney Dkt #: | 215801-9001-US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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16745705
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Filing Dt:
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01/17/2020
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Title:
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METHOD FOR MANUFACTURING BACKSIDE METALIZED COMPOUND SEMICONDUCTOR WAFER
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Assignee
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| NO. 753-799 MIN'AN AVENUE, HONGTANG TOWN |
| TONG'AN DISTRICT |
| XIAMEN, FUJIAN, CHINA 361100 |
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Correspondence name and address
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MICHAEL BEST & FRIEDRICH LLP (MKE)
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100 E WISCONSIN AVENUE
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SUITE 3300
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MILWAUKEE, WI 53202
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05/31/2024 07:24 AM
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