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Reel/Frame:054688/0770   Pages: 4
Recorded: 12/18/2020
Attorney Dkt #:252338-1190
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/16/2024
Application #:
17126102
Filing Dt:
12/18/2020
Publication #:
Pub Dt:
04/21/2022
Title:
MODULE EJECTION MECHANISM AND EXPANSION ASSEMBLY HAVING THE SAME
Assignor
1
Exec Dt:
11/27/2020
Assignee
1
NO.5, HSIN-ANN ROAD., HSINCHU SCIENCE PARK,
HSINCHU, TAIWAN 300
Correspondence name and address
MCCLURE, QUALEY & RODACK, LLP
280 INTERSTATE NORTH CIRCLE SE
SUITE 550
ATLANTA, GA 30339

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