Patent Assignment Details
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| Reel/Frame: | 013090/0771 | |
| Pages: | 3 |
| | Recorded: | 07/02/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/29/2003
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Application #:
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10188442
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Filing Dt:
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07/02/2002
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Title:
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METHOD FOR FORMING METAL FILLED SEMICONDUCTOR FEATURES TO IMPROVE A SUBSEQUENT METAL CMP PROCESS
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 121 PARK AVENUE 3 |
| HSIN-CHU, TAIWAN R.O.C |
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Correspondence name and address
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TUNG & ASSOC.
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RANDY W. TUNG
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838 W. LONG LAKE RD., STE. 120
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BLOOMFIELD, MI 48303
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