Patent Assignment Details
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| Reel/Frame: | 054324/0771 | |
| Pages: | 5 |
| | Recorded: | 11/10/2020 | | |
| Attorney Dkt #: | 7021.089US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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17027036
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Filing Dt:
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09/21/2020
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Publication #:
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Pub Dt:
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03/24/2022
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Title:
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LEAD-FREE SOLDER COMPOSITION
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Assignee
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| ERIN COURT |
| BISHOP'S COURT HILL |
| ST. MICHAEL, BARBADOS 14004 |
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Correspondence name and address
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MICHAEL A. COLLINS
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7401 METRO BLVD.
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SUITE 425
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MINNEAPOLIS, MN 55439
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