Total properties:
34
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Patent #:
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Issue Dt:
|
04/22/1986
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Application #:
|
06581856
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Filing Dt:
|
02/21/1984
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Title:
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APPARATUS FOR CONVEYING A SEMICONDUCTOR WAFER
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Patent #:
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|
Issue Dt:
|
06/06/2000
|
Application #:
|
09127762
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Filing Dt:
|
07/31/1998
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Title:
|
ETCHING PROCESS FOR PRODUCING SUBSTANTIALLY UNDERCUT FREE SILICON ON INSULATOR STRUCTURES
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|
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Patent #:
|
|
Issue Dt:
|
07/09/2002
|
Application #:
|
09239723
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Filing Dt:
|
01/29/1999
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Title:
|
MORPHED PROCESSING OF SEMICONDUCTOR DEVICES
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Patent #:
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|
Issue Dt:
|
07/10/2001
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Application #:
|
09406853
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Filing Dt:
|
09/29/1999
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Title:
|
ROTATING MAGNET ARRAY AND SPUTTER SOURCE
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Patent #:
|
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Issue Dt:
|
04/01/2003
|
Application #:
|
09658023
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Filing Dt:
|
09/08/2000
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Title:
|
MAGNETIC POLE FABRICATION PROCESS AND DEVICE
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|
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Patent #:
|
|
Issue Dt:
|
04/15/2003
|
Application #:
|
09696739
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Filing Dt:
|
10/26/2000
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Title:
|
MAGNETIC POLE FABRICATION PROCESS AND DEVICE
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|
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Patent #:
|
|
Issue Dt:
|
08/12/2003
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Application #:
|
09846214
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Filing Dt:
|
05/02/2001
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Publication #:
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Pub Dt:
|
11/07/2002
| | | | |
Title:
|
METHOD FOR THIN FILM LIFT-OFF PROCESSES USING LATERAL EXTENDED ETCHING MASKS AND DEVICE
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|
|
Patent #:
|
|
Issue Dt:
|
04/08/2003
|
Application #:
|
09996748
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Filing Dt:
|
11/30/2001
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Publication #:
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Pub Dt:
|
06/06/2002
| | | | |
Title:
|
EMBEDDED ATTENUATED PHASE SHIFT MASK AND METHOD OF MAKING EMBEDDED ATTENUATED PHASE SHIFT MASK
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Patent #:
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|
Issue Dt:
|
08/03/2004
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Application #:
|
10163567
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Filing Dt:
|
06/06/2002
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Publication #:
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|
Pub Dt:
|
01/30/2003
| | | | |
Title:
|
PERIMETER SEAL FOR BACKSIDE COOLING OF SUBSTRATES
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|
|
Patent #:
|
|
Issue Dt:
|
01/25/2005
|
Application #:
|
10407831
|
Filing Dt:
|
04/04/2003
|
Publication #:
|
|
Pub Dt:
|
11/20/2003
| | | | |
Title:
|
METHOD FOR ETCHING VIAS
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|
|
Patent #:
|
|
Issue Dt:
|
06/14/2005
|
Application #:
|
10601076
|
Filing Dt:
|
06/19/2003
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Publication #:
|
|
Pub Dt:
|
03/25/2004
| | | | |
Title:
|
NOTCH-FREE ETCHING OF HIGH ASPECT SOI STRUCTURES USING ALTERNATING DEPOSITION AND ETCHING AND PULSED PLASMA
|
|
|
Patent #:
|
|
Issue Dt:
|
01/03/2006
|
Application #:
|
10770839
|
Filing Dt:
|
02/02/2004
|
Publication #:
|
|
Pub Dt:
|
09/09/2004
| | | | |
Title:
|
END POINT DETECTION IN TIME DIVISION MULTIPLEXED ETCH PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2006
|
Application #:
|
10815965
|
Filing Dt:
|
03/31/2004
|
Publication #:
|
|
Pub Dt:
|
11/25/2004
| | | | |
Title:
|
METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2006
|
Application #:
|
10839809
|
Filing Dt:
|
05/03/2004
|
Publication #:
|
|
Pub Dt:
|
12/23/2004
| | | | |
Title:
|
ETCHING OF CHROMIUM LAYERS ON PHOTOMASKS UTILIZING HIGH DENSITY PLASMA AND LOW FREQUENCY RF BIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/05/2006
|
Application #:
|
10841818
|
Filing Dt:
|
05/06/2004
|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
Title:
|
ENVELOPE FOLLOWER END POINT DETECTION IN TIME DIVISION MULTIPLEXED PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2008
|
Application #:
|
11155904
|
Filing Dt:
|
06/20/2005
|
Publication #:
|
|
Pub Dt:
|
12/01/2005
| | | | |
Title:
|
METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2011
|
Application #:
|
11159415
|
Filing Dt:
|
06/23/2005
|
Publication #:
|
|
Pub Dt:
|
12/29/2005
| | | | |
Title:
|
METHOD AND APPARATUS FOR REDUCING ASPECT RATIO DEPENDENT ETCHING IN TIME DIVISION MULTIPLEXED ETCH PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2010
|
Application #:
|
11229319
|
Filing Dt:
|
09/16/2005
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Publication #:
|
|
Pub Dt:
|
04/06/2006
| | | | |
Title:
|
METHOD & APPARATUS TO IMPROVE PLASMA ETCH UNIFORMITY
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2009
|
Application #:
|
11441811
|
Filing Dt:
|
05/26/2006
|
Publication #:
|
|
Pub Dt:
|
12/21/2006
| | | | |
Title:
|
PROCESS CHANGE DETECTION THROUGH THE USE OF EVOLUTIONARY ALGORITHMS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/16/2010
|
Application #:
|
11502585
|
Filing Dt:
|
08/10/2006
|
Publication #:
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|
Pub Dt:
|
02/22/2007
| | | | |
Title:
|
OPTICAL EMISSION INTERFEROMETRY FOR PECVD USING A GAS INJECTION HOLE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2010
|
Application #:
|
11634377
|
Filing Dt:
|
12/04/2006
|
Publication #:
|
|
Pub Dt:
|
06/21/2007
| | | | |
Title:
|
METHOD FOR ETCHING PHOTOLITHOGRAPHIC SUBSTRATES
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11681805
|
Filing Dt:
|
03/05/2007
|
Publication #:
|
|
Pub Dt:
|
09/20/2007
| | | | |
Title:
|
Apparatus and Method for Carrying Substrates
|
|
|
Patent #:
|
|
Issue Dt:
|
01/11/2011
|
Application #:
|
11756074
|
Filing Dt:
|
05/31/2007
|
Publication #:
|
|
Pub Dt:
|
06/26/2008
| | | | |
Title:
|
TEMPERATURE CONTROL METHOD FOR PHOTOLITHOGRAPHIC SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2010
|
Application #:
|
11834127
|
Filing Dt:
|
08/06/2007
|
Publication #:
|
|
Pub Dt:
|
03/13/2008
| | | | |
Title:
|
METHOD FOR PLASMA ETCHING OF POSITIVELY SLOPED STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2012
|
Application #:
|
11834299
|
Filing Dt:
|
08/06/2007
|
Publication #:
|
|
Pub Dt:
|
02/14/2008
| | | | |
Title:
|
METHOD TO MINIMIZE CD ETCH BIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2012
|
Application #:
|
12689784
|
Filing Dt:
|
01/19/2010
|
Publication #:
|
|
Pub Dt:
|
02/03/2011
| | | | |
Title:
|
CONDUCTIVE SEAL RING ELECTROSTATIC CHUCK
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/2014
|
Application #:
|
13412119
|
Filing Dt:
|
03/05/2012
|
Publication #:
|
|
Pub Dt:
|
03/14/2013
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13445211
|
Filing Dt:
|
04/12/2012
|
Publication #:
|
|
Pub Dt:
|
10/17/2013
| | | | |
Title:
|
Method to Determine the Thickness of a Thin Film During Plasma Deposition
|
|
|
Patent #:
|
|
Issue Dt:
|
07/15/2014
|
Application #:
|
13448769
|
Filing Dt:
|
04/17/2012
|
Publication #:
|
|
Pub Dt:
|
09/20/2012
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2014
|
Application #:
|
13764110
|
Filing Dt:
|
02/11/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2014
|
Application #:
|
13764142
|
Filing Dt:
|
02/11/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
03/17/2015
|
Application #:
|
13764160
|
Filing Dt:
|
02/11/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2015
|
Application #:
|
13764177
|
Filing Dt:
|
02/11/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2015
|
Application #:
|
13767459
|
Filing Dt:
|
02/14/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|