Patent Assignment Details
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| Reel/Frame: | 007809/0773 | |
| Pages: | 4 |
| | Recorded: | 12/15/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/19/1997
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Application #:
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08573430
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Filing Dt:
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12/15/1995
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Title:
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APPARATUS FOR SEPARATING WAFERS FROM POLISHING PADS USED IN CHEMICAL-MECHANICAL PLANARIZATION OF SEMICONDUCTOR WAFERS
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Assignee
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| 8000 SOUTH FEDERAL WAY, P.O. BOX 6 |
| BOISE, IDAHO 83707 |
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Correspondence name and address
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SEED & BERRY
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PAUL T. PARKER
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701 FIFTH AVENUE
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6300 COLUMBIA CENTER
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SEATTLE, WA 98104-7092
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