Patent Assignment Details
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Reel/Frame: | 049348/0778 | |
| Pages: | 4 |
| | Recorded: | 06/03/2019 | | |
Attorney Dkt #: | 38009-4 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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16466156
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Filing Dt:
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06/03/2019
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Publication #:
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Pub Dt:
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02/27/2020
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Title:
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SEMICONDUCTOR MANUFACTURING PARTS COMPRISING SIC DEPOSITION LAYER, AND MANUFACTURING METHOD THEREFOR
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Assignee
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71 GAEJEONGSANEOPDANJI-RO |
MIYANG-MYEON ANSEONG-SI GYEONGGI-DO, KOREA, REPUBLIC OF 17602 |
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Correspondence name and address
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PATENT DOCKET DEPARTMENT ARMSTRONG TEASD
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7700 FORSYTH BOULEVARD
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SUITE 1800
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ST. LOUIS, MO 63105
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