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Total properties:
14
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Patent #:
|
|
Issue Dt:
|
09/18/2018
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Application #:
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14516700
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Filing Dt:
|
10/17/2014
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Publication #:
|
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Pub Dt:
|
05/14/2015
| | | | |
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Title:
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HIGH VOLTAGE POWER CHIP MODULE
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|
|
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Patent #:
|
|
Issue Dt:
|
12/05/2017
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Application #:
|
14918110
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Filing Dt:
|
10/20/2015
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Publication #:
|
|
Pub Dt:
|
04/20/2017
| | | | |
|
Title:
|
HIGH VOLTAGE POWER MODULE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2019
|
Application #:
|
15796138
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Filing Dt:
|
10/27/2017
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|
Publication #:
|
|
Pub Dt:
|
03/08/2018
| | | | |
|
Title:
|
HIGH VOLTAGE POWER MODULE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/22/2020
|
Application #:
|
15883714
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Filing Dt:
|
01/30/2018
|
|
Publication #:
|
|
Pub Dt:
|
08/01/2019
| | | | |
|
Title:
|
SILICON CARBIDE POWER MODULE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
08/18/2020
|
Application #:
|
16360333
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Filing Dt:
|
03/21/2019
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|
Publication #:
|
|
Pub Dt:
|
02/13/2020
| | | | |
|
Title:
|
HIGH VOLTAGE POWER MODULE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2021
|
Application #:
|
16441925
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Filing Dt:
|
06/14/2019
|
|
Publication #:
|
|
Pub Dt:
|
12/17/2020
| | | | |
|
Title:
|
PACKAGE FOR POWER ELECTRONICS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/21/2021
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Application #:
|
16936552
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Filing Dt:
|
07/23/2020
|
|
Publication #:
|
|
Pub Dt:
|
11/12/2020
| | | | |
|
Title:
|
HIGH VOLTAGE POWER MODULE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
08/22/2023
|
Application #:
|
16937857
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Filing Dt:
|
07/24/2020
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|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
POWER MODULE
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|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
16942082
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Filing Dt:
|
07/29/2020
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|
Publication #:
|
|
Pub Dt:
|
02/03/2022
| | | | |
|
Title:
|
SHIELDING ARRANGEMENTS FOR TRANSFORMER STRUCTURES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2023
|
Application #:
|
17239418
|
Filing Dt:
|
04/23/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
POWER MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/30/2024
|
Application #:
|
17352965
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Filing Dt:
|
06/21/2021
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2021
| | | | |
|
Title:
|
PACKAGE FOR POWER ELECTRONICS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/14/2024
|
Application #:
|
17459497
|
Filing Dt:
|
08/27/2021
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2023
| | | | |
|
Title:
|
ARRANGEMENTS OF POWER SEMICONDUCTOR DEVICES FOR IMPROVED THERMAL PERFORMANCE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/2021
|
Application #:
|
29663502
|
Filing Dt:
|
09/17/2018
|
|
Title:
|
POWER MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2021
|
Application #:
|
29663505
|
Filing Dt:
|
09/17/2018
|
|
Title:
|
POWER MODULE
|
|
