Patent Assignment Details
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| Reel/Frame: | 054899/0784 | |
| Pages: | 4 |
| | Recorded: | 01/05/2021 | | |
| Attorney Dkt #: | KIP-141US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17002008
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Filing Dt:
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08/25/2020
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Publication #:
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Pub Dt:
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03/04/2021
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Title:
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DIE PICKUP MODULE AND DIE BONDING APPARATUS INCLUDING THE SAME
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Assignee
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| 129, SAMSUNG-RO, YEONGTONG-GU,SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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RATNERPRESTIA
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2200 RENAISSANCE BLVD.
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SUITE 350
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KING OF PRUSSIA, PA 19406
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