Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 016826/0785 | |
| Pages: | 2 |
| | Recorded: | 07/28/2005 | | |
| Attorney Dkt #: | 19905A-004810US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/09/2007
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Application #:
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11121703
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Filing Dt:
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05/03/2005
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Publication #:
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Pub Dt:
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11/17/2005
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Title:
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METHOD OF BUMPING DIE PADS FOR WAFER TESTING
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Assignee
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| 2751 CENTERVILLE ROAD |
| LITTLE FALLS CENTER II |
| WILMINGTON, DELAWARE 19808 |
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Correspondence name and address
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WILLIAM L. SHAFFER
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TOWNSEND AND TOWNSEND AND CREW LLP
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TWO EMBARCADERO CENTER
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EIGHTH FLOOR
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SAN FRANCISCO, CA 94111-3834
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