Patent Assignment Details
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| Reel/Frame: | 033906/0786 | |
| Pages: | 3 |
| | Recorded: | 10/07/2014 | | |
| Attorney Dkt #: | 1314/225A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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14508989
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Filing Dt:
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10/07/2014
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Publication #:
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Pub Dt:
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04/09/2015
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Title:
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METHOD OF FABRICATING WAFER-LEVEL CHIP PACKAGE
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Assignee
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| 9F., NO. 23, JILIN RD. |
| ZHONGLI CITY, TAOYUAN COUNTY, TAIWAN 320 |
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Correspondence name and address
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WEN LIU
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350 S. FIGUEROA STREET, SUITE 975
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LOS ANGELES, CA 90071
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