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Reel/Frame:014454/0787   Pages: 5
Recorded: 09/05/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/20/2006
Application #:
10333199
Filing Dt:
09/02/2003
Publication #:
Pub Dt:
02/26/2004
Title:
METHOD AND SYSTEM FOR BONDING A SEMICONDUCTOR CHIP ONTO A CARRIER USING MICRO-PINS
Assignors
1
Exec Dt:
08/14/2003
2
Exec Dt:
08/08/2003
3
Exec Dt:
08/11/2003
Assignee
1
OFFICE OF TECHNOLOGY LICENSING AND INDUSTRY
RELATIONS - N5002
STONY BROOK, NEW YORK 11794-336
Correspondence name and address
BAKER BOTTS L.L.P.
ELIOT D. WILLIAMS
30 ROCKEFELLER PLAZA - 44 FL.
NEW YORK, NY 10112

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