Patent Assignment Details
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| Reel/Frame: | 051938/0788 | |
| Pages: | 6 |
| | Recorded: | 02/26/2020 | | |
| Attorney Dkt #: | 286513WOUS01_501152-56 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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16642186
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Filing Dt:
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02/26/2020
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Publication #:
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Pub Dt:
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10/01/2020
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Title:
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HOLE CONNECTING LAYER MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD
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Assignees
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| NO. 33, GUANGPUZHONG RD., SCIENCE CITY |
| HIGH-TECH INDUSTRIAL DEVELOPMENT DISTRICT |
| GUANGZHOU, GUANGDONG, CHINA 510663 |
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| 8-9/F, BLOCK A, BLDG 2, ZONE 1, SHENZHEN BAY SCIENCE AND TECHNOLOGY ECOLOGICAL PARK |
| INTERSECTION OF SHAHE RD. W. AND BAISHI RD., YUEHAI SUB-DISCTRICT, NANSHAN DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518057 |
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| NO. 1-4 QUINGYUAN AVENUE |
| QITING STREET |
| YIXING ,JIANGSU, CHINA 214200 |
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Correspondence name and address
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DORSEY & WHITNEY LLP
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111 S. MAIN STREET
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SUITE 2100
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SALT LAKE CITY, UT 84111
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