Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 040852/0789 | |
| Pages: | 5 |
| | Recorded: | 01/05/2017 | | |
Attorney Dkt #: | 106065-0103 |
Conveyance: | RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
10
|
|
Patent #:
|
|
Issue Dt:
|
12/14/1999
|
Application #:
|
09055675
|
Filing Dt:
|
04/06/1998
|
Title:
|
CONDUCTIVE SHEET MOLDING COMPOUND
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2001
|
Application #:
|
09686228
|
Filing Dt:
|
10/11/2000
|
Title:
|
Tonneau cover and attachment assembly
|
|
|
Patent #:
|
|
Issue Dt:
|
10/19/2004
|
Application #:
|
10000846
|
Filing Dt:
|
10/24/2001
|
Publication #:
|
|
Pub Dt:
|
04/24/2003
| | | | |
Title:
|
VACUUM ASSISTED MOLDING
|
|
|
Patent #:
|
|
Issue Dt:
|
08/24/2004
|
Application #:
|
10036707
|
Filing Dt:
|
11/08/2001
|
Publication #:
|
|
Pub Dt:
|
05/29/2003
| | | | |
Title:
|
REINFORCED POLYESTER RESINS HAVING INCREASED TOUGHNESS AND CRACK RESISTANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/28/2009
|
Application #:
|
11324941
|
Filing Dt:
|
01/04/2006
|
Publication #:
|
|
Pub Dt:
|
07/13/2006
| | | | |
Title:
|
POWDER PRIMEABLE LOW MOISTURE SMC
|
|
|
Patent #:
|
|
Issue Dt:
|
04/20/2010
|
Application #:
|
11434417
|
Filing Dt:
|
05/15/2006
|
Publication #:
|
|
Pub Dt:
|
11/16/2006
| | | | |
Title:
|
LOW-DENSITY MOLDING COMPOUND
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2008
|
Application #:
|
11597778
|
Filing Dt:
|
08/01/2007
|
Publication #:
|
|
Pub Dt:
|
02/14/2008
| | | | |
Title:
|
ENERGY ABSORBING VEHICLE BUMPER BRACKET
|
|
|
Patent #:
|
|
Issue Dt:
|
02/02/2010
|
Application #:
|
11875400
|
Filing Dt:
|
10/19/2007
|
Publication #:
|
|
Pub Dt:
|
04/24/2008
| | | | |
Title:
|
ELECTRICALLY CONDUCTIVE POLYESTER MOLDING COMPOSITION HAVING A HIGH QUALITY SURFACE FINISH
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2010
|
Application #:
|
12560958
|
Filing Dt:
|
09/16/2009
|
Publication #:
|
|
Pub Dt:
|
04/15/2010
| | | | |
Title:
|
POLYMERIC THICKENER FOR MOLDING COMPOUNDS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/28/2015
|
Application #:
|
12764345
|
Filing Dt:
|
04/21/2010
|
Publication #:
|
|
Pub Dt:
|
08/12/2010
| | | | |
Title:
|
LOW-DENSITY MOLDING COMPOUND
|
|
Assignee
|
|
|
255 REX BOULEVARD |
AUBURN HILLS, MICHIGAN 48326 |
|
Correspondence name and address
|
|
FOLEY & LARDNER LLP
|
|
3000 K STREET NW
|
|
SUITE 600
|
|
WASHINGTON, DC 20007
|
Search Results as of:
05/31/2024 09:01 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|