Patent Assignment Details
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| Reel/Frame: | 028084/0792 | |
| Pages: | 3 |
| | Recorded: | 04/20/2012 | | |
| Attorney Dkt #: | 1248/291 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13452595
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Filing Dt:
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04/20/2012
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Publication #:
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Pub Dt:
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10/25/2012
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Title:
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CHIP PACKAGE HAVING A FIRST AND SECOND CHIP BONDING WITH EACH OTHER
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Assignee
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| 9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
| JHONGLI CITY, TAOYUAN COUNTRY, TAIWAN 32062 |
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Correspondence name and address
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WEN LIU
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444 S. FLOWER STREET, SUITE 1750
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LOS ANGELES, CA 90071
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