Patent Assignment Details
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| Reel/Frame: | 021213/0794 | |
| Pages: | 10 |
| | Recorded: | 07/09/2008 | | |
| Attorney Dkt #: | 72167.000587 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11650103
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Filing Dt:
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01/05/2007
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Publication #:
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Pub Dt:
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07/12/2007
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Title:
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Integrated circuit package having metallic members intruding into solder balls
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Assignee
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| 270 PARK AVENUE |
| NEW YORK, NEW YORK 10036 |
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Correspondence name and address
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GEORGE WANG
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1900 K STREET NW
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SUITE 1200
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WASHINGTON, DC 20006
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05/28/2024 05:08 AM
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