Patent Assignment Details
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Reel/Frame: | 023921/0794 | |
| Pages: | 5 |
| | Recorded: | 02/09/2010 | | |
Attorney Dkt #: | APTI-199US1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11525428
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Filing Dt:
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09/22/2006
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Publication #:
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Pub Dt:
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01/25/2007
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Title:
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Method for fabricating low leakage interconnect layers in integrated circuits
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Assignee
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UNIT LEVEL 13 MAIN OFFICER TOWER |
FINANCIAL PARK LABUAN JALAN, MERDEKA |
LABUAN, MALAYSIA 87000 |
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Correspondence name and address
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KENNETH N. NIGON
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1235 WESTLAKES DRIVE, SUITE 301
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RATNERPRESTIA
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BERWYN, PA 19312
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