Patent Assignment Details
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Reel/Frame: | 020204/0796 | |
| Pages: | 4 |
| | Recorded: | 12/06/2007 | | |
Attorney Dkt #: | 111079-147370 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/29/2009
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Application #:
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11446305
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Filing Dt:
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06/02/2006
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Publication #:
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Pub Dt:
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12/06/2007
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Title:
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MICROELECTRONIC PACKAGE HAVING SOLDER-FILLED THROUGH-VIAS
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Assignee
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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SCHWABE, WILLIAMSON & WYATT, P.C.
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1211 SW FIFTH AVENUE, SUITE 1900
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PORTLAND, OR 97204
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