Patent Assignment Details
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| Reel/Frame: | 015895/0797 | |
| Pages: | 3 |
| | Recorded: | 10/13/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10964542
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Filing Dt:
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10/13/2004
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Publication #:
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Pub Dt:
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01/12/2006
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Title:
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Multilayer leadframe module with embedded passive component and method of fabricating the same
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Assignee
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| 5FL., NO. 5, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU 300, TAIWAN |
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Correspondence name and address
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THOMAS, KAYDEN, HORSTEMEYER & RISLEY LLP
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DANIEL R. MCCLURE
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100 GALLERIA PARKWAY, SUITE 1750
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ATLANTA, GEORGIA 30339-5948
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