Patent Assignment Details
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| Reel/Frame: | 025840/0803 | |
| Pages: | 3 |
| | Recorded: | 02/22/2011 | | |
| Attorney Dkt #: | 251420-1070 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/31/2012
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Application #:
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13031736
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Filing Dt:
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02/22/2011
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Publication #:
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Pub Dt:
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06/14/2012
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Title:
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METHOD FOR MANUFACTURING HEAT DISSIPATION BULK OF SEMICONDUCTOR DEVICE
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Assignee
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| NO. 1, TA-HSUEH ROAD |
| TAINAN CITY, TAIWAN |
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Correspondence name and address
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DANIEL R. MCCLURE
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600 GALLERIA PARKWAY, S.E.
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STE 1500
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ATLANTA, GA 30339-5994
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