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Reel/Frame:039847/0803   Pages: 3
Recorded: 08/26/2016
Attorney Dkt #:PA2904-0
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/19/2018
Application #:
15248435
Filing Dt:
08/26/2016
Publication #:
Pub Dt:
10/12/2017
Title:
SEMICONDUCTOR PACKAGES INCLUDING CHIP ENABLEMENT PADS
Assignors
1
Exec Dt:
08/09/2016
2
Exec Dt:
08/05/2016
3
Exec Dt:
08/09/2016
Assignee
1
2091, GYEONGCHUNG-DAERO, BUBAL-EUB
ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondence name and address
WILLIAM PARK & ASSOCIATES LTD.
930 N. YORK ROAD, SUITE 201
HINSDALE, IL 60521

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