Patent Assignment Details
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| Reel/Frame: | 017992/0804 | |
| Pages: | 2 |
| | Recorded: | 03/09/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10538584
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Filing Dt:
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03/09/2006
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Publication #:
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Pub Dt:
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12/21/2006
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Title:
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Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
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Assignee
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| 3672 OOAZA INA, INA-SHI, |
| NAGANO 396-0021, JAPAN |
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Correspondence name and address
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MARK MONTAGUE
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COWAN, LIEBOWITZ & LATMAN, P.C
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1133 AVENUE OF AMERICAS
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NEW YORK, NY 10036
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