Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 046676/0806 | |
| Pages: | 2 |
| | Recorded: | 08/23/2018 | | |
| Attorney Dkt #: | CU-100351 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/2020
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Application #:
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16109955
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Filing Dt:
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08/23/2018
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Publication #:
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Pub Dt:
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12/20/2018
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Title:
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EMBEDDED SILICON SUBSTRATE FAN-OUT TYPE 3D PACKAGING STRUCTURE
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Assignee
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| 112 LONGTENG ROAD, ECONOMIC AND TECHNICAL DEVELOPMENT ZONE |
| KUNSHAN, JIANGSU, CHINA 215300 |
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Correspondence name and address
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FLENER IP LAW, LLC
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77 WEST WASHINGTON STREET
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SUITE 800
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CHICAGO, IL 60602
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