Patent Assignment Details
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| Reel/Frame: | 055560/0809 | |
| Pages: | 2 |
| | Recorded: | 03/11/2021 | | |
| Attorney Dkt #: | CU-100273 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/20/2021
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Application #:
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15669780
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Filing Dt:
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08/04/2017
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Publication #:
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Pub Dt:
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06/28/2018
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Title:
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SEMICONDUCTOR CHIP, SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
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Assignee
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| NO. 18 CHENFENG ROAD |
| YUSHAN TOWN |
| KUNSHAN CITY, JIANGSU PROVINCE, CHINA 215300 |
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Correspondence name and address
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FLENER IP & BUSINESS LAW
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77 WEST WASHINGTON STREET
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SUITE 800
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CHICAGO, IL 60602
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