Patent Assignment Details
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| Reel/Frame: | 052218/0811 | |
| Pages: | 5 |
| | Recorded: | 03/24/2020 | | |
| Attorney Dkt #: | P56419-US1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S DATA PREVIOUSLY RECORDED ON REEL 020028 FRAME 0215. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/15/2012
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Application #:
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11912843
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Filing Dt:
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10/26/2007
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Publication #:
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Pub Dt:
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08/07/2008
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Title:
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INTEGRATED CIRCUIT ASSEMBLY WITH PASSIVE INTEGRATION SUBSTRATE FOR POWER AND GROUND LINE ROUTING ON TOP OF AN INTEGRATED CIRCUIT CHIP
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Assignee
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| HIGH TECH CAMPUS 60 |
| EINDHOVEN, NETHERLANDS 5656 AG |
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Correspondence name and address
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ERICSSON INC.
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6300 LEGACY DRIVE
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PLANO, TX 75024
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