Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 047067/0812 | |
| Pages: | 3 |
| | Recorded: | 10/04/2018 | | |
| Attorney Dkt #: | 0107195.00001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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05/17/2011
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Application #:
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12585681
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Filing Dt:
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09/22/2009
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Publication #:
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Pub Dt:
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04/01/2010
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Title:
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LEAD FRAME AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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05/29/2012
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Application #:
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12656866
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Filing Dt:
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02/18/2010
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Publication #:
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Pub Dt:
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08/26/2010
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Title:
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MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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02/14/2012
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Application #:
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12926938
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Filing Dt:
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12/20/2010
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Publication #:
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Pub Dt:
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04/21/2011
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Title:
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METHOD OF MANUFACTURING A LEAD FRAME WITH A NICKEL COATING
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13299653
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Filing Dt:
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11/18/2011
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Publication #:
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Pub Dt:
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03/15/2012
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Title:
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MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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06/09/2015
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Application #:
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13951612
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Filing Dt:
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07/26/2013
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Publication #:
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Pub Dt:
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11/21/2013
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Title:
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MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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08/15/2017
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Application #:
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15156730
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Filing Dt:
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05/17/2016
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Publication #:
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Pub Dt:
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11/24/2016
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Title:
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SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD THEREOF
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Assignee
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| 1746-2, OHKUCHI-USHIO |
| ISA-SHI, KAGOSHIMA, JAPAN 895-2501 |
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Correspondence name and address
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LOCKE LORD LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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