Patent Assignment Details
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| Reel/Frame: | 057734/0812 | |
| Pages: | 3 |
| | Recorded: | 10/07/2021 | | |
| Attorney Dkt #: | 890102.595 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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06/18/2024
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Application #:
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17494553
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Filing Dt:
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10/05/2021
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Publication #:
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Pub Dt:
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04/06/2023
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Title:
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METHOD AND SYSTEM FOR ADJUSTING LOCATION OF A WAFER AND A TOP PLATE IN A THIN-FILM DEPOSITION PROCESS
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SEED IP LAW GROUP LLP
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701 5TH AVE
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SUITE 5400
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SEATTLE, WA 98104
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06/08/2024 04:41 PM
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