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Reel/Frame:060762/0812   Pages: 4
Recorded: 08/09/2022
Attorney Dkt #:010829-9729.US00
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17884475
Filing Dt:
08/09/2022
Publication #:
Pub Dt:
02/15/2024
Title:
SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES
Assignors
1
Exec Dt:
08/05/2022
2
Exec Dt:
08/05/2022
3
Exec Dt:
08/08/2022
4
Exec Dt:
08/07/2022
5
Exec Dt:
08/09/2022
Assignee
1
8000 S. FEDERAL WAY
P.O. BOX 6
BOISE, IDAHO 83707-0006
Correspondence name and address
PERKINS COIE LLP - MICRON PATENT-SEA
PO BOX 1247
SEATTLE, WA 98111-1247

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