Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 061238/0813 | |
| Pages: | 3 |
| | Recorded: | 09/28/2022 | | |
| Attorney Dkt #: | FSALV-SAL012-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17913400
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Filing Dt:
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09/21/2022
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Publication #:
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Pub Dt:
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04/13/2023
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Title:
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An Implantable Electrical Device Comprising a Substrate, Encapsulation Layer and Adhesion Layer
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Assignee
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| HIGH TECH CAMPUS 41 |
| EINDHOVEN, NETHERLANDS 5656 AE |
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Correspondence name and address
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AUBREY Y CHEN
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11710 PLAZA AMERICA DRIVE
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SUITE 2000
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RESTON, VA 20190
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06/04/2024 09:44 AM
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