Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 019547/0816 | |
| Pages: | 4 |
| | Recorded: | 07/11/2007 | | |
| Attorney Dkt #: | 018865-019500US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2007
|
Application #:
|
11282967
|
Filing Dt:
|
11/18/2005
|
|
Publication #:
|
|
Pub Dt:
|
05/24/2007
| | | | |
|
Title:
|
SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MANUFACTURING
|
|
|
Assignee
|
|
|
|
|
| 82 RUNNING HILL ROAD |
| MS 35-4E |
| SOUTH PORTLAND, MAINE 04106 |
|
|
Correspondence name and address
|
| |
PATRICK R. JEWIK
|
| |
TOWNSEND AND TOWNSEND AND CREW LLP
|
| |
TWO EMBARCADERO CENTER, EIGHTH FLOOR
|
| |
SAN FRANCISCO, CALIFORNIA 94111-3834
|
Search Results as of:
05/24/2024 09:23 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
