Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 021304/0816 | |
| Pages: | 3 |
| | Recorded: | 07/28/2008 | | |
Attorney Dkt #: | 1937.1259 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE SECOND INVENTOR'S FIRST NAME PREVIOUSLY RECORDED ON REEL 021216, FRAME 0257. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12213868
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Filing Dt:
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06/25/2008
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Publication #:
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Pub Dt:
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01/08/2009
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Title:
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Multilayered printed circuit board and fabricating method thereof
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Assignee
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314, MAETAN3-DONG, YEONGTONG-GU, SUWON |
GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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Correspondence name and address
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STAAS & HALSEY LLP
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ATTENTION: DAVID M. PITCHER
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1201 NEW YORK AVE., N.W., 7TH FLOOR
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WASHINGTON, D.C. 20005
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