Patent Assignment Details
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| Reel/Frame: | 036056/0816 | |
| Pages: | 3 |
| | Recorded: | 07/10/2015 | | |
| Attorney Dkt #: | MRSI002-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14752190
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Filing Dt:
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06/26/2015
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Publication #:
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Pub Dt:
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12/31/2015
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Title:
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SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT SEMICONDUCTORS
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Assignee
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| 101 BILLERICA AVENUE, BLDG 3 |
| NORTH BILLERICA, MASSACHUSETTS 01862 |
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Correspondence name and address
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MAINE CERNOTA & RARDIN
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547 AMHERST ST., 3RD FLOOR
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NASHUA, NH 03063
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05/23/2024 09:31 PM
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