Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 044033/0817 | |
| Pages: | 2 |
| | Recorded: | 11/03/2017 | | |
| Attorney Dkt #: | NSE-03701 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/04/2020
|
Application #:
|
15803605
|
Filing Dt:
|
11/03/2017
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2018
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE WITH MULTIPLE MOLDING ROUTING LAYERS AND A METHOD OF MANUFACTURING THE SAME
|
|
|
Assignee
|
|
|
|
|
| 22 ANG MO |
| KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
|
|
Correspondence name and address
|
| |
THOMAS B. HAVERSTOCK
|
| |
162 N WOLFE ROAD
|
| |
SUNNYVALE, CA 94086
|
Search Results as of:
05/31/2024 04:47 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
