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Reel/Frame:016995/0818   Pages: 4
Recorded: 01/10/2006
Attorney Dkt #:CPAC 1103-2
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11274489
Filing Dt:
11/14/2005
Publication #:
Pub Dt:
08/31/2006
Title:
Encapsulation method for semiconductor device having center pad
Assignors
1
Exec Dt:
01/03/2006
2
Exec Dt:
01/03/2006
3
Exec Dt:
01/03/2006
Assignee
1
47400 KATO ROAD
FREMONT, CALIFORNIA 94538
Correspondence name and address
BILL KENNEDY
HAYNES BEFFEL & WOLFELD LLP
P.O. BOX 366
HALF MOON BAY, CA 94019

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