Total properties:
47
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Patent #:
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Issue Dt:
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10/28/2008
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Application #:
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10312589
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Filing Dt:
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05/19/2004
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Publication #:
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Pub Dt:
|
11/24/2005
| | | | |
Title:
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PACKAGING OF A MICROCHIP DEVICE
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Patent #:
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Issue Dt:
|
04/04/2006
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Application #:
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10347356
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Filing Dt:
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01/21/2003
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Publication #:
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Pub Dt:
|
01/22/2004
| | | | |
Title:
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MULTIPLE CHIP SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
|
10/16/2012
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Application #:
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10361814
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Filing Dt:
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02/11/2003
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Publication #:
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Pub Dt:
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10/23/2003
| | | | |
Title:
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MULTIPLE DIE STACK PACKAGE
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Patent #:
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Issue Dt:
|
07/26/2005
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Application #:
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10400803
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Filing Dt:
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03/28/2003
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Publication #:
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Pub Dt:
|
09/30/2004
| | | | |
Title:
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PACKAGED DEVICE WITH THERMAL ENHANCEMENT AND METHOD OF PACKAGING
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Patent #:
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Issue Dt:
|
04/22/2008
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Application #:
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10543301
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Filing Dt:
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07/26/2005
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Publication #:
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Pub Dt:
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04/27/2006
| | | | |
Title:
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MOLDED HIGH DENSITY ELECTRONIC PACKAGING STRUCTURE FOR HIGH PERFORMANCE APPLICATIONS
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Patent #:
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Issue Dt:
|
03/06/2012
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Application #:
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10721382
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Filing Dt:
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11/26/2003
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Publication #:
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Pub Dt:
|
06/03/2004
| | | | |
Title:
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HIGH DENSITY CHIP SCALE LEADFRAME PACKAGE AND METHOD OF MANUFACTURING THE PACKAGE
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Patent #:
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Issue Dt:
|
09/19/2006
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Application #:
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10812058
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Filing Dt:
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03/30/2004
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Publication #:
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Pub Dt:
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03/10/2005
| | | | |
Title:
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INTEGRATED CIRCUIT PACKAGE WITH LEADFRAME ENHANCEMENT AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
|
03/16/2010
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Application #:
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11260091
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Filing Dt:
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10/28/2005
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Publication #:
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Pub Dt:
|
08/31/2006
| | | | |
Title:
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SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE
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|
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Patent #:
|
|
Issue Dt:
|
05/20/2008
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Application #:
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11406357
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Filing Dt:
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04/19/2006
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Publication #:
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Pub Dt:
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10/25/2007
| | | | |
Title:
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LEADFRAME ENHANCEMENT AND METHOD OF PRODUCING A MULTI-ROW SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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10/18/2011
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Application #:
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11495781
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Filing Dt:
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07/31/2006
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Publication #:
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Pub Dt:
|
07/19/2007
| | | | |
Title:
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THERMALLY ENHANCED SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME
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Patent #:
|
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Issue Dt:
|
03/04/2008
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Application #:
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11536635
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Filing Dt:
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09/28/2006
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Publication #:
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Pub Dt:
|
03/29/2007
| | | | |
Title:
|
CAVITY CHIP PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
11/09/2010
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Application #:
|
11579326
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Filing Dt:
|
11/10/2008
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Publication #:
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|
Pub Dt:
|
03/19/2009
| | | | |
Title:
|
STRUCTURALLY-ENHANCED INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE
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|
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Patent #:
|
|
Issue Dt:
|
10/19/2010
|
Application #:
|
11662431
|
Filing Dt:
|
08/22/2007
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Publication #:
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|
Pub Dt:
|
06/26/2008
| | | | |
Title:
|
MULTI-DIE IC PACKAGE AND MANUFACTURING METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2016
|
Application #:
|
11846658
|
Filing Dt:
|
08/29/2007
|
Publication #:
|
|
Pub Dt:
|
03/13/2008
| | | | |
Title:
|
Method of Producing a Semiconductor Package
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|
|
Patent #:
|
|
Issue Dt:
|
05/25/2010
|
Application #:
|
11846665
|
Filing Dt:
|
08/29/2007
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Publication #:
|
|
Pub Dt:
|
03/06/2008
| | | | |
Title:
|
STACKED DIE PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/05/2010
|
Application #:
|
11959519
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Filing Dt:
|
12/19/2007
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Publication #:
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|
Pub Dt:
|
06/26/2008
| | | | |
Title:
|
INVERTED LEAD FRAME IN SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/04/2011
|
Application #:
|
12108563
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Filing Dt:
|
04/24/2008
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Publication #:
|
|
Pub Dt:
|
11/20/2008
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE WITH UNDER BUMP METALLIZATION ALIGNED WITH OPEN VIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/02/2010
|
Application #:
|
12124830
|
Filing Dt:
|
05/21/2008
|
Publication #:
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|
Pub Dt:
|
11/27/2008
| | | | |
Title:
|
METHOD OF ASSEMBLING A SILICON STACK SEMICONDUCTOR PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
02/08/2011
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Application #:
|
12124880
|
Filing Dt:
|
05/21/2008
|
Publication #:
|
|
Pub Dt:
|
01/01/2009
| | | | |
Title:
|
STACKED DIE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLY
|
|
|
Patent #:
|
|
Issue Dt:
|
10/04/2011
|
Application #:
|
12125924
|
Filing Dt:
|
05/23/2008
|
Publication #:
|
|
Pub Dt:
|
11/27/2008
| | | | |
Title:
|
MOLD DESIGN AND SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2013
|
Application #:
|
12133376
|
Filing Dt:
|
06/05/2008
|
Publication #:
|
|
Pub Dt:
|
12/11/2008
| | | | |
Title:
|
THROUGH SILICON VIA DIES AND PACKAGES
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|
|
Patent #:
|
|
Issue Dt:
|
03/27/2012
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Application #:
|
12133377
|
Filing Dt:
|
06/05/2008
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Publication #:
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|
Pub Dt:
|
12/11/2008
| | | | |
Title:
|
VENTED DIE AND PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
08/26/2014
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Application #:
|
12330681
|
Filing Dt:
|
12/09/2008
|
Publication #:
|
|
Pub Dt:
|
06/11/2009
| | | | |
Title:
|
FLIP-CHIP LEADFRAME SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2011
|
Application #:
|
12369429
|
Filing Dt:
|
02/11/2009
|
Publication #:
|
|
Pub Dt:
|
08/13/2009
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/21/2012
|
Application #:
|
12489409
|
Filing Dt:
|
06/22/2009
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Publication #:
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|
Pub Dt:
|
02/04/2010
| | | | |
Title:
|
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND ENHANCED WIRE BONDING PROCESS
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Patent #:
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|
Issue Dt:
|
02/26/2013
|
Application #:
|
12505552
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Filing Dt:
|
07/20/2009
|
Publication #:
|
|
Pub Dt:
|
01/21/2010
| | | | |
Title:
|
PACKAGING STRUCTURAL MEMBER
|
|
|
Patent #:
|
|
Issue Dt:
|
02/14/2012
|
Application #:
|
12604613
|
Filing Dt:
|
10/23/2009
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Publication #:
|
|
Pub Dt:
|
05/06/2010
| | | | |
Title:
|
INTERPOSER FOR SEMICONDUCTOR PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
02/11/2014
|
Application #:
|
12758820
|
Filing Dt:
|
04/13/2010
|
Publication #:
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|
Pub Dt:
|
10/14/2010
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR DEVICES
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|
Patent #:
|
|
Issue Dt:
|
10/01/2013
|
Application #:
|
13171421
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Filing Dt:
|
06/28/2011
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Publication #:
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|
Pub Dt:
|
12/29/2011
| | | | |
Title:
|
SUBSCRIBER IDENTITY MODULE (SIM) CARD
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Patent #:
|
|
Issue Dt:
|
05/06/2014
|
Application #:
|
13174923
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Filing Dt:
|
07/01/2011
|
Publication #:
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|
Pub Dt:
|
01/05/2012
| | | | |
Title:
|
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
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|
Patent #:
|
|
Issue Dt:
|
03/19/2013
|
Application #:
|
13244630
|
Filing Dt:
|
09/25/2011
|
Publication #:
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|
Pub Dt:
|
01/26/2012
| | | | |
Title:
|
MOLD DESIGN AND SEMICONDUCTOR PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
09/09/2014
|
Application #:
|
13295097
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Filing Dt:
|
11/14/2011
|
Publication #:
|
|
Pub Dt:
|
05/17/2012
| | | | |
Title:
|
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
|
07/08/2014
|
Application #:
|
13347683
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Filing Dt:
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01/10/2012
|
Publication #:
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Pub Dt:
|
05/03/2012
| | | | |
Title:
|
INTERPOSER FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
04/22/2014
|
Application #:
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13360796
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Filing Dt:
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01/29/2012
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Publication #:
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Pub Dt:
|
08/02/2012
| | | | |
Title:
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SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
|
10/14/2014
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Application #:
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13467050
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Filing Dt:
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05/09/2012
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Publication #:
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|
Pub Dt:
|
08/30/2012
| | | | |
Title:
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SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
|
05/05/2015
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Application #:
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13681302
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Filing Dt:
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11/19/2012
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Publication #:
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Pub Dt:
|
05/22/2014
| | | | |
Title:
|
LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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13737923
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Filing Dt:
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01/09/2013
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Publication #:
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Pub Dt:
|
05/16/2013
| | | | |
Title:
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PACKAGING STRUCTURAL MEMBER
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Patent #:
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Issue Dt:
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07/21/2015
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Application #:
|
13802769
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Filing Dt:
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03/14/2013
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Publication #:
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Pub Dt:
|
09/18/2014
| | | | |
Title:
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SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
|
12/23/2014
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Application #:
|
13831964
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Filing Dt:
|
03/15/2013
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Publication #:
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|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
|
04/04/2017
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Application #:
|
14051417
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Filing Dt:
|
10/10/2013
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Publication #:
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Pub Dt:
|
04/16/2015
| | | | |
Title:
|
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
06/03/2014
|
Application #:
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14058310
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Filing Dt:
|
10/21/2013
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Publication #:
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Pub Dt:
|
02/13/2014
| | | | |
Title:
|
THROUGH SILICON VIA DIES AND PACKAGES
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Patent #:
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Issue Dt:
|
10/20/2015
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Application #:
|
14094763
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Filing Dt:
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12/02/2013
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Publication #:
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Pub Dt:
|
09/18/2014
| | | | |
Title:
|
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
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Patent #:
|
|
Issue Dt:
|
08/25/2015
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Application #:
|
14257013
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Filing Dt:
|
04/21/2014
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Publication #:
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|
Pub Dt:
|
08/14/2014
| | | | |
Title:
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SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
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|
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Patent #:
|
|
Issue Dt:
|
09/15/2015
|
Application #:
|
14257017
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Filing Dt:
|
04/21/2014
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Publication #:
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Pub Dt:
|
08/14/2014
| | | | |
Title:
|
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
|
|
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Patent #:
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|
Issue Dt:
|
04/12/2016
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Application #:
|
14521481
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Filing Dt:
|
10/23/2014
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Publication #:
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Pub Dt:
|
03/05/2015
| | | | |
Title:
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SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
|
|
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Patent #:
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|
Issue Dt:
|
07/12/2016
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Application #:
|
14561157
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Filing Dt:
|
12/04/2014
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Publication #:
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Pub Dt:
|
03/26/2015
| | | | |
Title:
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SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
|
|
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Patent #:
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|
Issue Dt:
|
10/18/2016
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Application #:
|
14678840
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Filing Dt:
|
04/03/2015
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Publication #:
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|
Pub Dt:
|
07/30/2015
| | | | |
Title:
|
LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY
|
|