Patent Assignment Details
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| Reel/Frame: | 023302/0821 | |
| Pages: | 3 |
| | Recorded: | 09/30/2009 | | |
| Attorney Dkt #: | 8836-590 (II18134-US) |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF AN ASSIGNOR PREVIOUSLY RECORDED ON REEL 023158 FRAME 0303. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT THE NAME OF ASSIGNOR YONGJIN JANG TO YONGJIN JUNG. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/02/2011
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Application #:
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12549033
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Filing Dt:
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08/27/2009
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Publication #:
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Pub Dt:
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03/04/2010
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Title:
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SEMICONDUCTOR PACKAGE WHICH INCLUDES AN INSULATING LAYER LOCATED BETWEEN PACKAGE SUBSTRATES WHICH MAY PREVENT AN ELECTRICAL SHORT CAUSED BY A BONDING WIRE
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Assignee
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| 416, MAETAN-DONG, YEONGTONG-GU, |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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F. CHAU & ASSOCIATES, LLC
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130 WOODBURY ROAD
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WOODBURY, NY 11797
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