Patent Assignment Details
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| Reel/Frame: | 046656/0821 | |
| Pages: | 3 |
| | Recorded: | 08/22/2018 | | |
| Attorney Dkt #: | 83001.0064-00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/05/2020
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Application #:
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16108158
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Filing Dt:
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08/22/2018
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Publication #:
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Pub Dt:
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05/30/2019
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Title:
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LED CHIP WITH IMPROVED BONDING STRENGTH AND LED MODULE USING THE LED CHIP
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Assignee
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| 12 WONGOMAE-RO, GIHEUNG-GU |
| YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 17086 |
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Correspondence name and address
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MEI & MARK LLP
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P.O. BOX 65981
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WASHINGTON, DC 20035-5981
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05/29/2024 10:49 PM
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