Patent Assignment Details
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| Reel/Frame: | 009745/0822 | |
| Pages: | 3 |
| | Recorded: | 01/28/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/14/2001
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Application #:
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09239457
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Filing Dt:
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01/28/1999
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Title:
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GLOBAL PLANARIZATION METHOD FOR INTER-LAYER-DIELECTRIC AND INTER-METAL DIELECTRIC
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| 1, CREATION ROAD I |
| HSIN CHU, TAIWAN, CHINA |
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Correspondence name and address
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CLAUDE A.S. HAMRICK, ESQ.
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CHIEN-WEI (CHRIS) CHOU
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101 PARK CENTER PLAZA
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SUITE 400
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SAN JOSE CA 95113-2118
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