Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021901/0822 | |
| Pages: | 4 |
| | Recorded: | 12/02/2008 | | |
| Attorney Dkt #: | 18906-M019 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
12
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Patent #:
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Issue Dt:
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07/26/1994
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Application #:
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08122948
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Filing Dt:
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09/20/1993
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Title:
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CHEMICAL / MECHANICAL POLISHING FOR ULSI PLANARIZATION
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Patent #:
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Issue Dt:
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07/15/1997
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Application #:
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08625277
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Filing Dt:
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04/01/1996
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Title:
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CHEMICAL/MECHANICAL POLISH (CMP) ENDPOINT METHOD
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Patent #:
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Issue Dt:
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07/01/1997
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Application #:
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08652218
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Filing Dt:
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05/23/1996
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Title:
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CHEMICAL/MECHANICAL POLISH (CMP) THICKNESS MONITOR
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Patent #:
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Issue Dt:
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10/20/1998
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Application #:
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08654503
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Filing Dt:
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05/28/1996
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Title:
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CHEMICAL-MECHANICAL POLISH (CMP) PAD CONDITIONER
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Patent #:
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Issue Dt:
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06/10/1997
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Application #:
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08660307
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Filing Dt:
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06/07/1996
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Title:
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ELECTROCHEMICAL SIMULATOR FOR CHEMICAL-MECHANICAL POLISHING (CMP)
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Patent #:
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Issue Dt:
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02/16/1999
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Application #:
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08690405
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Filing Dt:
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07/25/1996
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Title:
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METHOD OF PLANARIZING WAFERS WITH SHALLOW TRENCH ISOLATION
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Patent #:
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Issue Dt:
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01/06/1998
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Application #:
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08694727
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Filing Dt:
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08/09/1996
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Title:
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CHEMICAL-MECHANICAL POLISHING (CMP) APPARATUS
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Patent #:
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Issue Dt:
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02/23/1999
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Application #:
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08866797
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Filing Dt:
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05/30/1997
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Title:
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TEMPERATURE COMPENSATED CHEMICAL MECHANICAL POLISHING TO ACHIEVE UNIFORM REMOVAL RATES
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Patent #:
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Issue Dt:
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02/16/1999
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Application #:
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08892215
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Filing Dt:
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07/14/1997
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Title:
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METHOD FOR MAKING AN IMPROVED GLOBAL PLANARIZATION SURFACE BY USING A GRADIENT-DOPED POLYSILICON TRENCH- FILL IN SHALLOW TRENCH ISOLATION
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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09033097
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Filing Dt:
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03/02/1998
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Title:
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CHEMICAL-MECHANICAL POLISH (CMP) PAD CONDITIONER
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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09156357
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Filing Dt:
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09/18/1998
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Title:
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DUAL DAMASCENE CMP PROCESS WITH BPSG REFLOWED CONTACT HOLE
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Patent #:
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Issue Dt:
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07/31/2001
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Application #:
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09378947
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Filing Dt:
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08/23/1999
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Title:
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EDGE AND BEVEL CMP OF COPPER WAFER
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Assignee
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| ROOM 1402, 14F, NO. 205, DUNHUA N. ROAD, SONGSHAN DISTRICT |
| TAIPEI CITY, TAIWAN |
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Correspondence name and address
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WPAT. P.C.
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1940 DUKE ST., SUITE 200
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ALEXANDRIA, VA 22314
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