Patent Assignment Details
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| Reel/Frame: | 038748/0825 | |
| Pages: | 7 |
| | Recorded: | 05/31/2016 | | |
| Attorney Dkt #: | ONS02050 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/07/2019
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Application #:
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15168467
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Filing Dt:
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05/31/2016
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Publication #:
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Pub Dt:
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11/30/2017
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Title:
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POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE
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Assignee
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| 5005 E. MCDOWELL ROAD |
| MAILDROP A700 |
| PHOENIX, ARIZONA 85008 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 E. MCDOWELL ROAD
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MAILDROP A700
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PHOENIX, AZ 85008
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